Global Semiconductor Advanced Packaging Strategic Business Report 2023 – Amkor Technology Leading Packaging Technology Innovation

DUBLIN, Nov. 30, 2023 /PRNewswire/ — The “Semiconductor Advanced Packaging – Global Strategic Business Report” has been added to ResearchAndMarkets.com’s offering.

The global market for Semiconductor Advanced Packaging estimated at US$35.8 Billion in the year 2022, is projected to reach a revised size of US$68 Billion by 2030, growing at a CAGR of 8.3% over the analysis period 2022-2030.

Flip Chip Packaging, one of the segments analyzed in the report, is projected to record 7.9% CAGR and reach US$49.1 Billion by the end of the analysis period. Growth in the 2.5d/3d Packaging segment is estimated at 10.9% CAGR for the next 8-year period.

The U.S. Market is Estimated at $3.3 Billion, While China is Forecast to Grow at 9.8% CAGR

The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3.3 Billion in the year 2022. China, the world’s second largest economy, is forecast to reach a projected market size of US$19.9 Billion by the year 2030 trailing a CAGR of 9.8% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.9% and 6.8% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 6.1% CAGR.

Key Market Trends & Drivers

• Digital Transformation Drive to Steer Future Growth of Advanced Packaging Market
• IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging
• New Packaging Technologies Crucial to Semiconductor Innovation
• 3D Chip Stacking Technology to Drive Future Advanced Packaging Technology
• 3D InCites – Advanced Packaging for 5G
• 2.5D Packaging Emerges as Powerful Option for Next-Generation AI Products
• Advanced Packaging Influences Design Chain
• Led by Innovation, Semiconductor Advanced Packaging Enters into Exciting Era
• Innovative Advanced Packaging Techniques to Flood the Market
• Amkor Technology Leading Packaging Technology Innovation
• Reducing the Cost of Advanced Packaging
• Investments in Advanced Packaging: A Critical Component for Resilient Semiconductor Supply Chain
• Trends in Consumer Electronics Sector Influence the Semiconductor Advanced Packaging Market
• Post Pandemic Recovery in CE Sector to Augment Prospects
• Review of Key CE Products Driving Adoption of Semiconductor Advanced Packaging Technology
• FOWLP and Challenges to Packaging Materials Suppliers
• Automobile Electronification Trends Widen the Addressable Market
• Anticipated Post COVID Recovery to Revive Opportunities in Aerospace Sector
• Sustained High Growth in ICT Sector Augurs Well
• Fan-Out Packaging: Promises & Key Challenges
• Implications of Chiplets & Related Designs for Advanced Packaging
• Solving Lithography Challenges
• Semiconductor Supply Chain: The Complex Nature & Vulnerabilities
• Vulnerabilities for WBG Power Semiconductors

Select Competitors Featured in the Report

• Advanced Micro Devices
• Applied Materials
• Avery Dennison
• Amkor Technology
• Advantest
• Brewer Science
• American Semiconductor
• ASM Pacific Technology
• ASE Technology Holding.
• AT & S Austria Technologie & Systemtechni
• BE Semiconductor Industries
• Amtech Microelectronics
• APSTL
• Boschman Technologies
• ASE Korea

Key Topics Covered:

1. MARKET OVERVIEW

• Easing Unemployment Levels in 2021 Although Moderate Will Infuse Hope for Industries Reliant on Consumer Discretionary Incomes: Global Number of Unemployed People (In Million) for Years 2019, 2020, 2021, and 2022
• Impact of COVID-19 on the Semiconductor Industry Exposes the Risk of Value Chain Modularity
• Among the Hammered Companies in the Supply Chain is the “Semiconductor Industry”
• Measuring the Impact of COVID-19 on the Semiconductor Industry in Terms of Disruption & Time to Recovery (In Months) as of May 2020
• Supply Chain Disruptions Impact a Large Number of Electronic Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due to COVID-19 Worldwide as of May 2020
• Semiconductor Trends for Specific End-Use Categories
• COVID-19 Pandemic Storm Warrants New Strategies to Help Semiconductor Leaders Secure New Lease of Life
• Falling Consumer Confidence Impacts Sales of Automotive and Consumer Electronics
• Industrial Activity Remain Subdued in 2020
• Global PMI Index Points for the Years 2018, 2019 & 2020
• Competitive Scenario
• Semiconductor Supply Chain Transitions at Various Levels
• Financial Performances of Packaging Suppliers Reveals New Growth Players
• Unconventional Players Joining Semiconductor Advanced Packaging Bandwagon
• Semiconductor Advanced Packaging – Global Key Competitors Percentage Market Share in 2022 (E)
• Semiconductor Advanced Packaging Competitor Market Share Scenario Worldwide (in %): 2020E
• Competitive Market Presence – Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
• Flip Chip Packaging (Technology) Global Competitor Market Share Positioning for 2020 & 2027
• 2.5D/3D Packaging (Technology) Market Share Breakdown of Key Players: 2020 & 2027
• FI WLP (Technology) Competitor Revenue Share (in %): 2020 & 2027
• FO WLP (Technology) Market Share Shift by Company: 2020 & 2027
• Rising Semiconductor Demand Presents Bundle of Joy for Advanced Packaging Market
• Prominent Factors Stirring Semiconductor Advanced Packaging Market
• Global Market Prospects & Outlook
• Flip-Chip: Key Contributing Segment
• Rising Investments to Benefit Market
• Key Trends to Drive Semiconductor Advanced Packaging Market
• Regional Analysis
• An Introduction to Semiconductor Advanced Packaging
• Recent Market Activity

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

For more information about this report visit https://www.researchandmarkets.com/r/2kw5c

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